BM-R6000 BGA Rework Station | Infrared Heating & One‑Key Operation
The BM‑R6000 is a compact BGA rework station designed for motherboard, chip and LED board repair. It features intelligent one‑key desoldering, three independent temperature zones and infrared heating for precise and even temperature control. With laser positioning, dual temperature measurement and multiple safety protections, it is easy to operate and highly reliable. Ideal for repair shops, labs and small manufacturing, it delivers stable performance and high rework yield.
BM-R6000 Small BGA Chip Motherboard Rework Station - Product Details
BM Technology
CE Certified
High Precision | One-Click Operation | Efficient Rework
Product Overview
The BM-R6000 Small BGA Chip Motherboard Rework Station is a high-performance professional device engineered for the rework of motherboards, electronic chips, and LED light boards. Equipped with self-developed core software, infrared heating technology, and precise temperature zone control, it features one-click desoldering and soldering with zero learning cost for operators.
Compact in design with industrial-grade stability, this rework station is ideal for electronic repair shops, small-scale manufacturing plants, R&D laboratories, and electronic maintenance teams. It delivers accurate, efficient, and reliable BGA chip rework solutions, significantly improving repair efficiency and yield while reducing operational costs.
Core Advantages
One-Click Rework, Zero Learning Threshold
Built-in self-developed professional control software with pre-set mature desoldering and soldering process parameters. No manual debugging or professional technical training is required—one-click startup completes the entire chip rework process. This design eliminates the complexity of traditional equipment parameter setting, enabling both novice and experienced technicians to achieve efficient operation.
3 Independent Temperature Zones, Infrared Heating for Uniformity
Adopts upper, lower, and preheating three independent temperature zone control design with a maximum total power of 4.0KW (Upper: 0.8KW | Lower: 0.8KW | Preheating: 2.4KW). Integrated infrared heating technology ensures fast heating speed and uniform temperature conduction, effectively avoiding local overheating and deformation of PCB boards. It perfectly matches the heating requirements of different chip sizes, ensuring high rework yield.
Laser Positioning, Pinpoint Accurate Rework
Equipped with high-precision laser positioning function that quickly and accurately captures the position of chip solder joints. Realizes precise alignment of chip desoldering and soldering, completely avoiding errors caused by manual positioning. Reduces the risk of damage to chips and PCB boards, making rework operations more accurate and worry-free.
Multi-Layer Safety Protection, Safe and Reliable Operation
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Temperature Parameter Permission Protection: Core temperature parameters are protected by authority settings to prevent random modification by non-professionals, avoiding equipment failure or rework errors caused by incorrect parameters.
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Over-Temperature Safety Protection: Built-in intelligent temperature protection mechanism that automatically triggers protection when the temperature exceeds the set range, safeguarding equipment and operational safety.
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CE Certification: Complies with international industrial safety and quality standards, with industrial-grade materials and craftsmanship for long-term stable operation.
User-Friendly Design, Enhanced Operational Experience
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USB Plug-and-Play: Supports USB driver-free quick connection to computers for auxiliary control and real-time data transmission. Automatically generates temperature curve analysis reports for process optimization and operation record-keeping.
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2-Channel Temperature Measurement Interfaces: Equipped with two professional temperature measurement interfaces with external K-type sensors, realizing multi-point precise temperature detection of PCBs and BGA chips. Master the temperature change of heating areas in real time for precise process control.
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Humanized Hardware Configuration: Integrated lighting lamp, heat dissipation fan, replaceable upper heating nozzle, and adjustable bracket sliders. Rich peripheral interfaces are compatible with various auxiliary equipment, providing a smooth and efficient operational experience.
Technical Specifications
Item |
Specification |
|---|---|
Model |
BM-R6000 |
Power Supply |
AC220V±10% 50/60Hz |
Maximum Power |
4.0KW (Upper:0.8KW; Lower:0.8KW; Preheating:2.4KW) |
Applicable Chip Size |
2x2mm - 60x60mm (Max) |
Max PCB Board Size |
400x380mm |
Preheating Area |
400x300mm |
Temperature Measurement Interfaces |
2 Pcs |
Overall Dimensions |
520520550mm |
Net Weight |
25KG |
Heating Method |
Infrared Heating + Hot Air Heating |
Core Functions |
One-Click Desoldering/Soldering, Laser Positioning, Independent Temperature Zone Control, USB Driver-Free |
Safety Protection |
Temperature Parameter Permission Protection, Over-Temperature Protection |
Certification |
CE Certified |
Temperature Sensor |
Dual-Channel K-Type Sensor |
Product Structure Analysis
The BM-R6000 adopts a modular and rational structural design, combining practicality and durability, with all key components designed for professional rework operations:
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Upper Heater: With replaceable heating nozzles and adjustable hot air flow, suitable for heating chips of different sizes and specifications.
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Lighting System: Built-in high-brightness lighting lamp provides a clear field of vision for fine rework operations, eliminating visual blind spots.
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Heat Dissipation Fan: Real-time efficient heat dissipation protects internal components and extends the service life of the equipment.
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Adjustable Bracket Sliders: Flexible spacing adjustment to fix PCB boards of different sizes, ensuring firm clamping without loosening during operation.
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Peripheral Interface Area: Integrates USB, temperature measurement and other interfaces to meet the needs of device connection, data transmission and precise temperature detection.
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Operation Panel: Clearly marked buttons for temperature zone switch, power adjustment, start and power supply—simple and intuitive operation, easy to master.
Application Scenarios
✅ Motherboard rework (computer, laptop, industrial control board)✅ BGA chip desoldering and soldering of LED light boards and display screens✅ Rework of small and medium-sized electronic equipment chips✅ Daily rework operations in electronic repair shops✅ Batch chip rework in small electronic manufacturing plants✅ Electronic process R&D and testing in universities and laboratories✅ On-site maintenance of electronic equipment in industrial fields
Why Choose BM-R6000?
1. Professional R&D & Customized Technology
Self-developed control software and core rework processes, tailored to the actual needs of the electronic rework industry, with higher operational adaptability and stability.
2. High Efficiency & Low Operation Cost
One-click rework + laser positioning shortens the single chip rework time by more than 50%, significantly improving work efficiency and reducing labor costs.
3. High Precision & High Yield
Three independent temperature zones + infrared heating technology ensure precise temperature control, avoiding PCB board damage and improving rework yield.
4. Industrial-Grade Durability & Safety
Multi-layer safety protection + high-quality industrial-grade materials, ensuring long-term stable operation and low failure rate.
5. Compact Design & Wide Adaptability
Small footprint, easy to place and move, suitable for various workplaces such as repair shops, laboratories and production lines.
6. Complete Configuration & Ready to Use
Comprehensive standard accessories, no additional purchase of basic consumables required—unbox and use directly, saving installation and debugging time.
Standard Configuration
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BM-R6000 Rework Station Main Unit × 1
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Upper Heating Nozzle (Standard) × 1 Set
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External K-Type Temperature Measurement Line × 2
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Power Cord × 1
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Operation Manual (English) × 1
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Product Qualification Certificate × 1
