BRUNIMIND BM2500L Fully Automatic Online Desoldering & Ball Mounting Welding Equipment
Core Equipment for Defective Product Repair in Semiconductor Chip Packaging | High-Precision Laser Ball Mounting, Full-Process Intelligent Operation
Product Overview
The BRUNIMIND BM2500L Fully Automatic Online Desoldering and Ball Mounting Welding Equipment is a dedicated device for repairing defective products in the semiconductor chip packaging process, focusing on the automated operation needs of the entire process of desoldering, ball mounting and welding in the chip packaging link. Equipped with a single-point ball mounting laser welding system, integrated with human-machine intelligent control and a high-precision intelligent motion system, it can seamlessly connect with the front and rear process equipment of the SMT production line and be compatible with the BGA industry standard process requirements. It provides semiconductor packaging and testing enterprises with an efficient, accurate and flexible solution for defective product repair, greatly reducing process losses and improving production line yield and production efficiency.
Core Specifications
| Item | Specification |
|---|---|
| Model | BM2500L |
| Overall Dimension | L1420×W1280×H1850mm |
| Rated Power | 5KW |
| Equipment Weight | 1200KG |
| Compatible Tray | 323×136×8mm (BGA industry standard tray) |
| Loading & Unloading Method | Standard SMT flow channel type |
| Transmission Component | Adjustable anti-static synchronous belt component |
Core Product Features
Laser Welding for Precise and Damage-Free Operation
Adopting a single-point ball mounting laser welding system and non-contact single-point desoldering technology, combined with high-precision laser positioning and detection technology, it achieves micron-level precise desoldering and ball mounting, effectively avoiding thermal and physical damage to chip pads and surrounding substrates, and ensuring the performance stability of repaired chips.
Full-Process Intelligence for Easy and Efficient Operation
Equipped with an intelligent motion control system, it supports the storage of multiple sets of product formula programs. For chips of different specifications and different repair processes, formulas can be retrieved with one click, enabling simple and fast line changeover, greatly shortening the production line switching time and adapting to the production and repair needs of multi-variety and small-batch production. The human-machine interactive control interface is concise in design with a low operation threshold, which can be operated without professional high-skilled personnel.
High Production Line Compatibility for Seamless Connection and Integration
Equipped with a standard SMT flow channel type loading and unloading structure, combined with an adjustable anti-static synchronous belt component, it can be directly connected to other process equipment at the front and rear ends of the production line without additional production line transformation, featuring strong overall compatibility. It is perfectly adapted to BGA industry standard trays, meeting the general process carrier requirements of the semiconductor packaging and testing industry.
Stable and Reliable for Industrial Mass Production
The equipment body adopts a high-rigidity structural design with low vibration and high positioning accuracy during operation, enabling long-term continuous and stable operation and adapting to industrial mass production environments. The anti-static design runs through the entire process, effectively avoiding the risk of electrostatic breakdown of semiconductor chips caused by static electricity and ensuring the safety of repair operations.
Core Application Advantages
Non-Contact Process Improves Repair Yield
Non-contact single-point desoldering and ball mounting fundamentally solve the problems of pad scratch, solder paste residue and ball mounting offset easily caused by traditional contact processes. Laser welding ensures uniform tin melting and full and round solder joints after ball mounting, greatly improving the repair yield.
Online Operation Mode Optimizes Production Line Efficiency
The fully automatic online operation design eliminates the need for manual loading, unloading and transfer, and is directly integrated into the existing SMT production process, realizing the integrated connection of "inspection - repair - reflow", reducing the waiting time between processes and improving the overall production efficiency and automation level of the production line.
Flexible Adaptation to Meet Diverse Demands
It can store multiple sets of process formulas and support the repair of defective semiconductor chip packaging products of different sizes and packaging types, taking into account both R&D small-scale testing and mass production large-scale operation, and adapting to the diverse process needs of semiconductor packaging and testing enterprises.
Precise Temperature Control Ensures Chip Performance
The laser welding system can accurately control laser energy and action time to achieve local precise heating with a small heat-affected zone, effectively avoiding performance attenuation and structural deformation of chips caused by high temperature, and ensuring the electrical and mechanical properties of repaired chips.
Application Scenarios
The BRUNIMIND BM2500L Fully Automatic Online Desoldering and Ball Mounting Welding Equipment is mainly applicable to the repair of defective products in the semiconductor chip packaging process. It is widely used in the desoldering, ball mounting and welding repair of chip packaging types such as BGA and CSP, and is adapted to the semiconductor chip packaging and testing production lines in the fields of consumer electronics, communication equipment, industrial control, automotive electronics and so on. It is a core equipment for semiconductor packaging and testing enterprises to reduce production costs and improve product yield.
Brand Assurance
BRUNIMIND is deeply engaged in the field of semiconductor precision manufacturing equipment, focusing on the high precision, high stability and high compatibility of equipment. With advanced technical design, strict quality control standards and perfect after-sales service, we provide customized process solutions for semiconductor manufacturing enterprises. All equipment has undergone multiple rounds of industrial environment tests to ensure stable operation in mass production scenarios. At the same time, we provide a full life cycle of services including technical support around the clock, equipment installation and commissioning, operation training and regular maintenance, escorting the stable operation of customers' production lines.
Cooperation Inquiries
BRUNIMIND looks forward to working with you to empower the development of the semiconductor industry with precision manufacturing equipment and provide you with efficient, accurate and reliable technical solutions for your production and manufacturing!
