BRUNIMIND XL-6500 Automatic In-Line Microfocus X-Ray Inspection System
BRUNIMIND XL-6500 Automatic In-Line Microfocus X-Ray Inspection System
Brand Overview
BRUNIMIND is a leading provider of core solutions in the field of industrial precision inspection. We specialize in the R&D, manufacturing, and customization of high-end X-ray inspection equipment. With our technological advantages of high precision, high automation, and high adaptability, we empower quality upgrading in electronics manufacturing, semiconductors, new energy, and other industries, building stable and efficient non-destructive inspection systems for global manufacturers.
Brand Philosophy
Upholding the philosophy of Precision Inspection for Micro Details, Intelligent Manufacturing for the Future, BRUNIMIND deeply cultivates industrial X-ray inspection technologies and focuses on the precise inspection needs of the electronics manufacturing industry. Based on independently developed core technologies, we create full-scenario-adaptable inspection equipment. From the precise refinement of core components to the intelligent optimization of the overall system, we always aim for "zero blind spots in inspection, zero defects in quality", providing customers with full-process services from equipment selection to customized solutions, helping manufacturers achieve both efficient production and quality control.
Core Product: XL-6500 Automatic In-Line Microfocus X-Ray Inspection System
Key Product Highlights
The BRUNIMIND XL-6500 is an in-line microfocus X-ray inspection system specially designed for electronic assemblies. It supports both seamless in-line production integration and flexible off-line operation. It can perform fully automatic intelligent inspection on characteristic areas of circuit boards and designated components, with an inspection accuracy of 5–15μm and magnification up to 200X. It easily captures tiny defects, avoids product quality risks from the source, and supports customized equipment configuration to meet different production scenarios.
Core Advantages
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Wide Industry Coverage & Multi-Type AdaptationSuitable for fully automatic in-line inspection of LED chip packaging and IGBT chips. It also covers ICs, BGAs, semiconductor devices, SMT & PTU packaging, sensors, and other fields, as well as high-precision inspection of large-size PCBs and PCBA solder joints, providing one-stop inspection solutions for electronics manufacturing.
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High Automation & Cost EfficiencyEquipped with a fully automatic inspection and judgment system, it completes the whole inspection process without manual intervention, greatly improving inspection efficiency and reducing labor costs. It seamlessly connects with SMT production lines to realize integrated line inspection, avoiding production interruptions and ensuring production tempo.
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Easy Operation & Low Learning ThresholdAdopts a simplified template setting mode, allowing operators to get started quickly after basic training. The system supports fast product changeover, adapting to multi-variety, small-batch production and shortening preparation time.
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Safety & Stable OperationEquipped with multiple safety protections and intelligent interlock systems, strictly complying with industrial equipment safety standards to ensure operator safety. Core components have passed rigorous tests, featuring high operational stability and low failure rates, supporting reliable continuous production.
Core Hardware Specifications
| Category | Item | Technical Specifications |
|---|---|---|
| X-Ray Tube | Tube Type | Reflective sealed microfocus X-ray source |
| Operating Voltage | 0–90KV / 40–130KV | |
| Operating Current | 0–200μA / 10–300μA | |
| Max Output Power | 8W / 39W | |
| Focal Spot Size | 5–15μm | |
| Flat Panel Detector | Detector Type | Amorphous silicon flat panel detector (optional) |
| Pixel Matrix | 1536×1536 | |
| Field of View | 130mm×130mm | |
| Resolution | 5.8Lp/mm | |
| Frame Rate (1×1) | 20fps | |
| AD Conversion | 16bits | |
| General | Dimensions | L1600mm×W1700mm×H2100mm |
| Control System | Industrial PC, WIN10 64-bit | |
| Power Supply | 220V 10A / 110V 16A, 50–60Hz | |
| Net Weight | Approx. 2350KG |
Typical Applications
- Automotive Electronics: Solder joint and packaging inspection for copper-substrate LED automotive headlights, IGBT chip inspection for automotive power control modules
- Lighting Components: Bubble detection and packaging defect inspection for LED marine lights
- Semiconductors: BGA chip soldering quality analysis, internal structure inspection for high-power IGBT modules
- PCB Manufacturing: Inspection of cold solder joints, bridges, voids, and other defects in PCBs and PCBAs
- Electronic Packaging: Internal non-destructive inspection for ICs, sensors, PTU packages, and other devices
- Applications
Copper Substrate LED Automotive Headlights Copper Substrate LED Automotive Headlights Copper Substrate LED Automotive Headlights 
Copper Substrate LED Automotive Headlights Copper Substrate LED Automotive Headlights Copper Substrate LED Automotive Headlights 
Copper Substrate LED Automotive Headlights Copper Substrate LED Automotive Headlights Copper Substrate LED Automotive Headlights 
LED Dock Light Bubble Testing LED Dock Light Bubble Testing LED Dock Light Bubble Testing 
LED Dock Light Bubble Testing LED Dock Light Bubble Testing LED Dock Light Bubble Testing 
LED Dock Light Bubble Testing LED Dock Light Bubble Testing LED Dock Light Bubble Testing 
BGA Chip Soldering Analysis BGA Chip Soldering Analysis Copper Substrate LED Automotive Headlights 
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
High-Power Semiconductor IGBT Modules
Technical Strength
BRUNIMIND has a professional R&D team with deep experience in industrial X-ray inspection. We focus on the R&D and innovation of core technologies including microfocus X-ray sources, intelligent inspection algorithms, and automatic control systems, establishing a complete technical R&D system.
We achieve independent optimization of microfocus X-ray sources to ensure inspection accuracy and stability. Our software integrates intelligent image recognition and automatic judgment algorithms, greatly reducing missed and false detections. Each device undergoes multi-scenario and long-term performance testing before delivery to ensure reliable performance in industrial environments.
Customization & After-Sales Support
Customized Solutions
Understanding the diverse inspection needs across industries, BRUNIMIND provides full-process customized services. We tailor inspection modules, control systems, and interfaces according to customers’ production layout, inspection types, and accuracy requirements. We also support customized integration with customers’ MES systems for data connectivity and intelligent management.
Comprehensive After-Sales Service
- Fast Technical Support: 7×24-hour technical consultation with a nationwide service network and on-site support
- Professional Installation & Training: On-site installation, commissioning, and one-on-one operator training
- Regular Inspection & Maintenance: Proactive equipment inspections to eliminate potential failures; long-term warranty for core components
- Lifetime Technical Support: Continuous software and hardware upgrades to keep inspection capabilities aligned with industry standards
SEO Keywords (for Google)
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Secondary:industrial X-ray inspection, SMT X-ray machine, semiconductor X-ray inspection, IGBT X-ray detection, non-destructive testing equipment, electronics manufacturing inspection
