BRUNIMIND Semiconductor Chip Clean Curing Oven - High Yield Dual-Rail Curing Solution
BRUNIMIND Semiconductor Chip Clean Curing Oven
Product Overview
BRUNIMIND Semiconductor Chip Clean Curing Oven is the first domestic dual-rail clean curing furnace independently R&D by our team, engineered to solve the core pain points of camera chip packaging and curing in semiconductor manufacturing. Targeting the stringent production requirements of ultra-thin, miniaturized semiconductor chips with surging market demand, it breaks the limitations of traditional curing equipment with superior quality, ultra-high yield, high productivity and a compact footprint.
Specialized for the packaging and curing of semiconductor chips such as camera modules, this oven features precise temperature control, Class 100 cleanroom-level internal environment and an efficient dual-rail conveying system. It has been fully verified and adopted by Fortune 500 enterprises, and is the ideal high-end curing solution for high-volume, high-precision semiconductor chip manufacturing in consumer electronics, automotive electronics and optical device industries.
Core Technical Advantages
Superior Curing Quality & High Product Yield
- Segmented independent heating zones: 5 heating zones with dual-rail design (10 temperature zones total), PID closed-loop control + SSR drive, ±1.0℃ temperature control precision, max set temperature 300℃
- Zero temperature cross-contamination: No heat cross between adjacent heating zones, temperature difference up to 100℃, fully adaptable to various temperature curve curing processes for semiconductor chips
- Class 100 clean internal environment: Advanced multi-stage filtration system with high-cleanliness air duct design, meets dust-free production standards for high-precision semiconductor packaging
- Efficient water cooling system: Equipped with dedicated water cooling zone, rapidly cools products to around 50℃ before output, avoiding thermal damage to sensitive semiconductor chips
Ultra-High Production Efficiency & Dual-Rail Design
- Patented stepping dual-rail handling system: Full-automatic dual-line high-efficiency production, precise and fast transportation, 2x productivity of single-rail equipment
- Industry-leading UPH: Up to 4000pcs per hour (170 trays ×24 PCS/tray ×2 rails), UPH adjustable according to different product specifications
- Fast cycle time: CT (takt time) as low as 21 seconds, matching the high-speed production rhythm of semiconductor manufacturing lines
- High-capacity tray compatibility: Customized tray size (L150mm×W75mm×H2mm) with 24 PCS per tray, optimized for camera chip and small semiconductor component curing
Compact Footprint & Easy Operation
- Space-saving structural design: Overall dimensions only L1400MM×W1800MM×H2100MM (2.1m after lifting), drastically reduces floor space compared with traditional curing furnaces (several to tens of meters long), ideal for intensive production line planning
- Intelligent control & MES integration: Equipped with BRUNIMIND smart control system, supports real-time MES data docking via barcode scanning; real-time monitoring and recording of temperature zone data, curing curves and board passing information
- Humanized maintenance design: Liftable main unit + retractable docking machine, enables fast and convenient daily maintenance and overhaul, significantly reducing maintenance time and costs
- Comprehensive data management: Built-in board counting and temperature curve recording functions, realizes full-process production data traceability for quality control
Technical Specifications
| No. | Item | HQP-75B05-D Specifications |
|---|---|---|
| 1 | Overall Dimensions (L*W*H) | L1400MM × W1800MM × H2100MM |
| 2 | Net Weight | Approx. 1500KG |
| 3 | Heating Zones | 5 heating zones, dual-rail (10 temperature zones total) |
| 4 | Exhaust Gas Outlets | 1 PCS |
| 5 | Water Cooling Devices | 2 PCS |
| 6 | Minimum Water Pressure | 4 Bar |
| 7 | Compressed Air Pressure | 0.4 MPa |
| 8 | Power Supply | 3 Phase 380V 50/60 HZ |
| 9 | Heating Power | 15 KW |
| 10 | Temperature Setting Range | Room temperature ~ 300°C |
| 11 | Temperature Control Method | PID closed-loop control + SSR drive |
| 12 | Temperature Control Precision | ±1.0°C |
| 13 | Operating Environment Temperature | 5-60°C |
| 14 | Parameter Storage & Integration | Barcode scanning for MES system docking |
| 15 | Abnormal Alarm | Temperature anomaly alarm (overhigh/low temp after constant temperature) |
| 16 | Water Cooling Temperature | 15±2°C |
| 17 | Board Inlet Height | 950±20mm |
| 18 | CT (Takt Time) | 21 S (3600/170=21s) |
| 19 | Curing Capacity (UPH) | ＞4000pcs (170 trays ×24 PCS/tray) |
| 20 | Tray Size | L150mm × W75mm × H2mm (24 PCS/tray) |
| 21 | Cleanliness Class | Class 100 dust-free (exterior: computer white baking paint; inner cavity: stainless steel) |
| 22 | Board Counting Function | Equipped |
| 23 | Temperature Curve Recording Function | Equipped |
Note: The above specifications are subject to change without prior notice.
Key Application Fields
BRUNIMIND Semiconductor Chip Clean Curing Oven is a professional high-precision curing equipment for semiconductor manufacturing, mainly applied to:
- Camera Module Chips: Packaging and curing of smartphone, tablet and automotive camera module chips (the core application scenario)
- Miniature Semiconductor Chips: Curing of ultra-thin, miniaturized IC chips and sensor chips for consumer electronics
- Optical Semiconductor Components: Curing of optical semiconductor chips for display screens, optical lenses and imaging devices
- Automotive Semiconductor Chips: High-reliability curing of automotive-grade camera and sensor chips for intelligent driving
- Precision Microelectronic Components: Packaging and curing of high-precision microelectronic chips with dust-free and high-temperature precision requirements
Enterprise Strength & Service Guarantee
Industry-Leading R&D & Manufacturing Capabilities
- National high-tech enterprise and Shenzhen specialized, sophisticated and innovative enterprise with over 100 patents and intellectual property rights
- Obtained SGS, ISO9001 Quality Management System and EU CE certifications, complying with international semiconductor manufacturing standards
- R&D team of nearly 100 senior engineers with over 10 years of industry experience, led by renowned industry experts in precision thermal processing
- 40,000 square meter modern production base in Dongguan, with advanced manufacturing and testing equipment, leading production scale in the industry
Recognized by Global Top Enterprises
The product has been massively adopted and verified by Fortune 500 enterprises and leading semiconductor manufacturers including Foxconn, BYD, Xiaomi, OPPO, Bosch, UNIC Electronics, JCET, BOE and Lenovo, with proven stable performance in mass production lines.
5-Star Full-Lifecycle Professional Service
BRUNIMIND provides one-stop customized service covering the entire product life cycle for semiconductor manufacturing customers:
- Pre-sales: On-site project explanation, production line planning, customized curing process solution design
- Sales: Customer visit reception, on-site product demonstration, technical Q&A and process matching
- After-sales: Door-to-door delivery and installation (including unpacking and hoisting), on-site commissioning and debugging
- Training: Professional operator and maintenance personnel technical training
- Long-term support: Regular equipment maintenance, spare parts supply, on-site technical support and process optimization guidance
