Brunimind AIBM63X Series-SPI Online 3D Solder Paste Inspection System for PCBA

This is the Brunimind AIBM63X Series‑SPI online 3D solder paste inspection equipment for PCBA. It uses phase modulation measurement technology to detect solder paste defects such as less tin, more tin, offset and bridging, and measures height, volume and area. It supports closed‑loop control with printer, fast bad board recognition, one‑key operation and web SPC real‑time monitoring. Suitable for inline inspection after SMT printer.

AlBM63X Series-SPI

Product Model AlBM63X Series-SPI

 

Product Name  Online PCBA 3D Solder Paste Inspection Equipment (SPI)

 

Equipment Structure Diagram

 

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630- B Structural Drawing 630B-D Structural Drawing

 

 

Product Application Scope

 

This 3D solder paste inspection (SPI) system detects critical printing defects including insufficient solder, excess solder, tip pulling, and abnormal tin shape, while accurately measuring the height, volume, and area of printed solder paste for PCBA production.

 

 

Test Case

 

Solder Bridging Position Deviation Insufficient / Excess Solder Solder Paste Shape & Height

 

Equipment Principle

 

Adopting phase modulation profilometry technology, the Brunimind AIS63X Series-SPI enables high-precision 3D measurement of printed solder paste, delivering exceptional measurement accuracy while maintaining high-speed inspection performance for SMT lines.

 

Core Advantages

 

  • 3-point lighting system for enhanced measurement stability
  • Closed-loop control integration with SMT screen printers
  • Fast bad board identification & BadMark point sharing with pick-and-place machines
  • Minimal programming, one-key operation, and multi-computer interconnection
  • Full-board image data storage capability
  • Web-based SPC support for real-time quality monitoring and analysis

 

Launch Scheme

 

Ideal for inline deployment after the SMT screen printer to enable real-time solder paste quality control in electronic manufacturing.

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